방열 그리스
heat sink compound: ADC12 다이캐스트 알루미늄, 공차 ±0.15 mm, 표면 하드 아노다이즈 Type III, 25-40 µm, 리드타임 12 영업일, MOQ 1000 pcs. 텔레콤 및 기지국용 생산 능력 50,000 pcs. 도면 검토 및 초도품 보고서 포함.
heat sink compound: ADC12 다이캐스트 알루미늄, 공차 ±0.15 mm, 표면 하드 아노다이즈 Type III, 25-40 µm, 리드타임 12 영업일, MOQ 1000 pcs. 텔레콤 및 기지국용 생산 능력 50,000 pcs. 도면 검토 및 초도품 보고서 포함.
방열판 정의: 1050A aluminium, tolerance ±0.20 mm, surface sandblast + epoxy powder coating RAL 9005, lead time 12 working days, MOQ 5000 pcs. Capacity 800,000 pcs for telecom and base station. Drawing review and first-article report included.
SSD 방열판: 1050A aluminium, tolerance ±0.10 mm, surface black anodize Type II, 10-15 µm, lead time 15 working days, MOQ 1000 pcs. Capacity 800,000 pcs for VFD and inverter. Drawing review and first-article report included.
Seeed Studio XIAO용 알루미늄 방열판: 1050A aluminium, tolerance ±0.15 mm, surface zinc-nickel plating, trivalent passivation, lead time 15 working days, MOQ 2000 pcs. Capacity 120,000 pcs for IGBT power module. Drawing review and first-article report included.
숫자 제어 가공 프로그래밍 기술: Steel 4140 / 4340, tolerance ±0.005 mm, surface hard chrome plate 0.025 mm, lead time 15 working days, MOQ 500 pcs. Capacity for automotive. Drawing review and first-article report included.